- chip packaging
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сборка ИС
Англо-русский словарь технических терминов. 2005.
chip packaging
Смотреть что такое "chip packaging" в других словарях:
Chip tridimensional (3D) — En electrónica, un circuito integrado tridimensional, o simplemente chip tridimensional (chip 3D), es un chip compuesto por dos o más capas de componentes electrónicos activos, integrados tanto vertical como horizontalmente, y formando un único… … Wikipedia Español
CHIP — can mean several things: * State Children s Health Insurance Program *As CHiP for the California Highway Patrol * one of various Child Identification Programs around the world **Masonic Child Identification Programs in many states in the United… … Wikipedia
Chip carrier — A standard sized 8 pin dual in line package (DIP) containing a 555 timer IC. A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or… … Wikipedia
Chip scale package — A chip scale package (CSP) (sometimes, chip scale package with a hyphen) is a type of integrated circuit chip carrier. Originally, CSP was the acronym for chip size packaging. Since only a few packages are chip size, the meaning of the acronym… … Wikipedia
Chip-On-Board — У этого термина существуют и другие значения, см. COB. Модуль видеоматрицы отображения информации … Википедия
Multi-chip module — POWER5 MCM with four processors and four 36 MB external L3 cache dies on a ceramic multi chip module. A multi chip module (MCM) is a specialized electronic package where multiple integrated circuits (ICs), semiconductor dies or other discrete… … Wikipedia
Integrated circuit packaging — Early USSR made integrated circuit Integrated circuit packaging is the final stage of semiconductor device fabrication per se, followed by IC testing.Packaging in ceramic or plastic prevents physical damage and corrosion and supports the… … Wikipedia
Electronic packaging — is a major discipline within the field of electronic engineering, and includes a wide variety of technologies. It refers to enclosures and protective features built into the product itself, and not to shipping containers. It applies both to end… … Wikipedia
Flip-chip pin grid array — (FC PGA or FCPGA) is a form of pin grid array processor architecture package in which the die faces downwards on the top of the CPU with the back of the die exposed. This allows the die to have a more direct contact with the heatsink or other… … Wikipedia
Food packaging — is packaging for food. It requires protection, tampering resistance, and special physical, chemical, or biological needs. It also shows the product that is labeled to show any nutrition information on the food being consumed.Food packaging s… … Wikipedia
Chocolate chip cookie — Home made chocolate chip cookies Origin … Wikipedia
