- flip-chip design
- конструкция с перевернутыми кристаллами
Большой англо-русский и русско-английский словарь. 2001.
flip-chip design
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Design for testing — Design for Test (aka Design for Testability or DFT ) is a name for design techniques that add certain testability features to a microelectronic hardware product design. The premise of the added features is that they make it easier to develop and… … Wikipedia
Design For Test — (aka Design for Testability or DFT ) is a name for design techniques that add certain testability features to a microelectronic hardware product design. The premise of the added features is that they make it easier to develop and apply… … Wikipedia
Chip tridimensional (3D) — En electrónica, un circuito integrado tridimensional, o simplemente chip tridimensional (chip 3D), es un chip compuesto por dos o más capas de componentes electrónicos activos, integrados tanto vertical como horizontalmente, y formando un único… … Wikipedia Español
Flip-flop (electronics) — An SR latch, constructed from a pair of cross coupled NOR gates. Red and black mean logical 1 and 0 , respectively. In electronics, a flip flop or latch is a circuit that has two stable states and can be used to store state information. The… … Wikipedia
Power network design (IC) — In integrated circuits, electrical power is distributed to the components of the chip over a network of conductors on the chip. Power network design (IC) includes the analysis and design of such networks. As in all engineering, this involves… … Wikipedia
Digital Equipment Corporation — Industry Computer manufacturing Fate Assets were sold to various companies. What remained was sold to Compaq. Successor … Wikipedia
Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… … Wikipedia
Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… … Wikipedia
Field-programmable gate array — FPGAs should not be confused with the flip chip pin grid array, a form of integrated circuit packaging. A field programmable gate array is a semiconductor device containing programmable logic components called logic blocks , and programmable… … Wikipedia
MMIC — Archivo:MMIC antenna.jpg MMIC antena. Los circuitos MMI o MMIC (Monolithic Microwave Integrated Circuits) son un tipo de circuitos integrados que operan en frecuencias de microondas, es decir, entre 300 MHz y 300 GHz. La técnica de fabricación de … Wikipedia Español
Soft error — In electronics and computing, an error is a signal or datum which is wrong. Errors may be caused by a defect, usually understood either to be a mistake in design or construction, or a broken component. A soft error is also a signal or datum which … Wikipedia
