wire bonding
51Flip Chip — Puce retournée Flip chip …
52Puce retournee — Puce retournée Flip chip …
53Puce retournée — Flip chip Câblage par fil Dans le domaine des …
54Counterfeit electronic components — While counterfeiting has existed for centuries, the appearance of counterfeit electronic components is a relatively new phenomenon, unique to the 21st century[citation needed] and the digital age. Mankind has become increasingly dependent on… …
55Quad-flat no-leads package — 28 pin QFN, upside down to show contacts and thermal/ground pad Flat no leads packages such as QFN (quad flat no leads) and DFN (dual flat no leads) physically and electrically connect integrated circuits to printed circuit boards. Flat no leads …
56P5 (microarchitecture) — The Intel P5 Pentium family Produced From 1993 to 1999 Common manufacturer(s) Intel Max. CPU clock rate 60 MH …
57Chip tridimensional (3D) — En electrónica, un circuito integrado tridimensional, o simplemente chip tridimensional (chip 3D), es un chip compuesto por dos o más capas de componentes electrónicos activos, integrados tanto vertical como horizontalmente, y formando un único… …
58Chip-und-Draht-Bonden — lusto ir vielinių išvadų sujungimas statusas T sritis radioelektronika atitikmenys: angl. die and wire bonding vok. Chip und Draht Bonden, n rus. соединение кристалла ИС и проволочных выводов, n pranc. connexion puce fil, f …
59connexion puce-fil — lusto ir vielinių išvadų sujungimas statusas T sritis radioelektronika atitikmenys: angl. die and wire bonding vok. Chip und Draht Bonden, n rus. соединение кристалла ИС и проволочных выводов, n pranc. connexion puce fil, f …
60lusto ir vielinių išvadų sujungimas — statusas T sritis radioelektronika atitikmenys: angl. die and wire bonding vok. Chip und Draht Bonden, n rus. соединение кристалла ИС и проволочных выводов, n pranc. connexion puce fil, f …
