wire bonding
31Gold-aluminium intermetallics — are intermetallic compounds of gold and aluminium that occur at contacts between the two metals. These intermetallics have different properties than the individual metals which can cause problems in wire bonding in microelectronics. The main… …
32NaREC — (National Renewable Energy Centre) Type Not for Profit Industry Renewable Energy Energy Efficiency Founded 2002 Founder(s) One North East Headquarters …
33Purpurpest — Der Begriff Purpurpest bezeichnet in der Aufbau und Verbindungstechnik einen häufigen Ausfallmechanismus von drahtgebondeten Gold Aluminium Kontakten durch Wachstum von intermetallischen Gold Aluminium Verbindungen. Über Lebenszeit wachsen diese… …
34Floorplanning — is the act of designing of a floorplan, which is a kind of bird s eye view of a structure. Electronic design automationIn electronic design automation, floorplanning takes in some of the geometrical limitations in a design. Examples of this are:* …
35Conformal coating — material is applied to electronic circuitry to act as protection against moisture, dust, chemicals, and temperature extremes that, if uncoated (non protected), could result in damage or failure of the electronics to function. When electronics… …
36Microfabrication — Synthetic detail of a micromanufactured integrated circuit through four layers of planarized copper interconnect, down to the polysilicon (pink), wells (greyish) and substrate (green) Microfabrication is the term that describes processes of… …
37Прикрепление проволоки — Межсоединение чипа кристалла и корпуса через напаянную на них алюминиевую проволоку …
38Restriction of Hazardous Substances Directive — European Union directive: Directive 2002/95/EC Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment Made by Council Parliament …
39Power MOSFET — A Power MOSFET is a specific type of Metal Oxide Semiconductor Field Effect Transistor (MOSFET) designed to handle large power. Compared to the other power semiconductor devices (IGBT, Thyristor...), its main advantages are high commutation speed …
40Microfluidics — deals with the behavior, precise control and manipulation of fluids that are geometrically constrained to a small, typically sub millimeter, scale. Typically, micro means one of the following features: small volumes (nl, pl, fl) small size low… …
