wire bonding
21Gold plating — is a method of depositing a thin layer of gold onto the surface of another metal, most often copper or silver, by chemical or electrochemical means.Mechanical or chemical affixing of thin gold foils onto the surface of objects is instead known as …
22Bond — Bond, bonds, bonded, and bonding may refer to:Fiduciary bonds*Bond (finance), in finance, a debt security, issued by Issuer **Government bond, a bond issued by a national government ***Government bond register, a register of bonds issued by a… …
23Flip chip — Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and MEMS, to external circuitry with solder bumps that have been deposited onto the chip pads …
24Gold — This article is about the metal. For the color, see Gold (color). For other uses, see Gold (disambiguation). platinum ← gold → mercury …
25Integrated circuit packaging — Early USSR made integrated circuit Integrated circuit packaging is the final stage of semiconductor device fabrication per se, followed by IC testing.Packaging in ceramic or plastic prevents physical damage and corrosion and supports the… …
26Корпусирование ИС — Ранняя советская микросхема К1ЖГ453 Корпусирование интегральных схем  завершающая стадия микроэлектронного производства, в процессе которой полупроводниковый кристалл устанавливается в корпус. Обычно состоит из этапов прикрепления крис …
27Kirkendall effect — The Kirkendall effect is the migration of markers that occurs when markers are placed at the interface between an alloy and a metal, and the whole is heated to a temperature where diffusion is possible; the markers will move towards the alloy… …
28QFN — A QFN or Quad Flat No leads or a MLF package is an integrated circuit package which falls under Surface mount technology packages used on printed circuit boards. This kind of package is similar to the Quad Flat Package, but the leads do not… …
29Semiconductor device fabrication — Semiconductor manufacturing processes 10 µm 1971 3 µm 1975 1.5 µm 1982 …
30Finetech — Infobox Company company name = Finetech GmbH Co. KG company company type = GmbH Co. KG foundation = 1992 location city = Berlin location country = Germany Headquarters = Berlin key people = Gunter Kuerbis, CEO industry = Engineering products =… …
