sputtering deposition
1Sputtering — is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic ions. It is commonly used for thin film deposition, etching and analytical techniques (see below). Physics of sputtering Physical… …
2Sputtering — Pulvérisation cathodique La pulvérisation cathodique est une méthode de dépôt de couche mince. Sommaire 1 Principe 1.1 Synthèse de films céramiques 1.2 Instabilité électrique …
3Sputtering — A process used to apply photovoltaic semi conductor material to a substrate by a physical vapor deposition process where high energy ions are used to bombard elemental sources of semiconductor material, which eject vapors of atoms that are then …
4Pulsed laser deposition — (PLD) is a thin film deposition (specifically a physical vapor deposition, PVD) technique where a high power pulsed laser beam is focused inside a vacuum chamber to strike a target of the desired composition. Material is then vaporized from the… …
5Sputter deposition — is a physical vapor deposition (PVD) method of depositing thin films by sputtering, that is ejecting, material from a target, that is source, which then deposits onto a substrate, such as a silicon wafer. Resputtering is re emission of the… …
6Thin-film deposition — is any technique for depositing a thin film of material onto a substrate or onto previously deposited layers. Thin is a relative term, but most deposition techniques allow layer thickness to be controlled within a few tens of nanometers, and some …
7High Power Impulse Magnetron Sputtering — (HIPIMS, also known as High Impact Power Magnetron Sputtering and High Power Pulsed Magnetron Sputtering, HPPMS) is a method for physical vapor deposition of thin films which is based on magnetron sputter deposition. HIPIMS utilises extremely… …
8Pulvérisation cathodique (sputtering) — Pulvérisation cathodique La pulvérisation cathodique est une méthode de dépôt de couche mince. Sommaire 1 Principe 1.1 Synthèse de films céramiques 1.2 Instabilité électrique …
9Plasma-enhanced chemical vapor deposition — PECVD machine at LAAS technological facility in Toulouse, France. Plasma enhanced chemical vapor deposition (PECVD) is a process used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Chemical reactions are involved… …
10Evaporation (deposition) — Evaporation machine used for metallization at LAAS technological facility in Toulouse, France. Evaporation is a common method of thin film deposition. The source material is evaporated in a vacuum. The vacuum allows vapor particles to travel… …
