soldering

  • 101Ball grid array — For other uses, see BGA (disambiguation). Intel Embedded Pentium MMX (bottom view) A ball grid array (BGA) is a type of surface mount packaging used for integrated circuits. Contents …

    Wikipedia

  • 102Heat sink — A heat sink (or heatsink) is an environment or object that absorbs and dissipates heat from another object using thermal contact (either direct or radiant). Heat sinks are used in a wide range of applications wherever efficient heat dissipation… …

    Wikipedia

  • 103Rosin — For other uses, see Rosin (disambiguation). A cake of rosin, made for use by violinists, used here for soldering . Rosin, also called colophony or Greek pitch (Pix græca), is a solid form of resin obtained from pines and some other plants, mostly …

    Wikipedia

  • 104Restriction of Hazardous Substances Directive — European Union directive: Directive 2002/95/EC Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment Made by Council Parliament …

    Wikipedia

  • 105Reflow oven — A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards.Types of Reflow Ovens Infrared and Convection Ovens The oven contains multiple zones, which can be individually… …

    Wikipedia

  • 106Solder paste — (or solder cream) is used for connecting the terminations of the IC packages with that of land patterns on the PCB. The paste is applied to the lands by printing the solder using a stencil, while other methods like screening and dispensing are… …

    Wikipedia

  • 107Thermal management of electronic devices and systems — Heat generated by electronic devices and circuitry must be dissipated to improve reliability and prevent premature failure. Techniques for heat dissipation can include heatsinks and fans for air cooling, and other forms of computer cooling such… …

    Wikipedia

  • 108Copper wire and cable — Copper has been used in electric wiring since the invention of the electromagnet and the telegraph in the 1820s.[1][2] The invention of the telephone in 1876 proved to be another early boon for copper wire.[3] Today, despite competition from… …

    Wikipedia

  • 109Gold plating — is a method of depositing a thin layer of gold onto the surface of another metal, most often copper or silver, by chemical or electrochemical means.Mechanical or chemical affixing of thin gold foils onto the surface of objects is instead known as …

    Wikipedia

  • 110Filigree — For the concrete system, see Filigree concrete. sterling Horse and Buggy, Filigree work …

    Wikipedia