single wafer processing
1single-wafer processing — nuoseklusis plokštelių apdorojimas statusas T sritis radioelektronika atitikmenys: angl. single wafer processing vok. Einzelwaferbearbeitung, f rus. последовательная обработка пластин, f pranc. traitement séquentiel des tranches, m …
2Wafer-scale integration — Wafer scale integration, WSI for short, is a yet unused system of building very large integrated circuit networks that use an entire silicon wafer to produce a single super chip . Through a combination of large size and reduced packaging, WSI… …
3Wafer (electronics) — Polished 12 and 6 silicon wafers. The flat cut into the right wafer indicates its doping and crystallographic orientation (see below) …
4Rapid thermal processing — (or RTP) refers to a semiconductor manufacturing process which heats silicon wafers to high temperatures (up to 1200 C or greater) on a timescale of several seconds or less. The wafers must be brought down (temperature) slow enough however, so… …
5SWP — Systematic Withdrawal Plan (Governmental » Military) *** Swap file (Computing » File Extensions) * Schoolwide Program (Community » Educational) * Swakopmund, Namibia (Regional » Airport Codes) * Skill With Prizes (Community » Sports) * Southwest… …
6Einzelwaferbearbeitung — nuoseklusis plokštelių apdorojimas statusas T sritis radioelektronika atitikmenys: angl. single wafer processing vok. Einzelwaferbearbeitung, f rus. последовательная обработка пластин, f pranc. traitement séquentiel des tranches, m …
7nuoseklusis plokštelių apdorojimas — statusas T sritis radioelektronika atitikmenys: angl. single wafer processing vok. Einzelwaferbearbeitung, f rus. последовательная обработка пластин, f pranc. traitement séquentiel des tranches, m …
8traitement séquentiel des tranches — nuoseklusis plokštelių apdorojimas statusas T sritis radioelektronika atitikmenys: angl. single wafer processing vok. Einzelwaferbearbeitung, f rus. последовательная обработка пластин, f pranc. traitement séquentiel des tranches, m …
9последовательная обработка пластин — nuoseklusis plokštelių apdorojimas statusas T sritis radioelektronika atitikmenys: angl. single wafer processing vok. Einzelwaferbearbeitung, f rus. последовательная обработка пластин, f pranc. traitement séquentiel des tranches, m …
10Three-dimensional integrated circuit — In electronics, a three dimensional integrated circuit (3D IC, 3D IC, or 3 D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor… …
