silicon-on-insulator structures
1Silicon on insulator — technology (SOI) refers to the use of a layered silicon insulator silicon substrate in place of conventional silicon substrates in semiconductor manufacturing, especially microelectronics, to reduce parasitic device capacitance and thereby… …
2Silicon nitride — Preferred IUPAC name Silicon nitride …
3Insulator (electrical) — Ceramic insulator at railways Conducting copper wire insulate …
4Silicon — Not to be confused with the silicon containing synthetic polymer silicone. aluminium ← silicon → phosphorus C ↑ Si ↓ Ge …
5insulator — /in seuh lay teuhr, ins yeuh /, n. 1. Elect. a. a material of such low conductivity that the flow of current through it is negligible. b. insulating material, often glass or porcelain, in a unit form designed so as to support a charged conductor… …
6Optical modulators using semiconductor nano-structures — Contents 1 Optical modulators using semiconductor nano structures 1.1 Electro optic modulator of nano structures 1.2 Acousto optic modulator of nano structures …
7Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… …
8High-k dielectric — The term high κ dielectric refers to a material with a high dielectric constant (κ) (as compared to silicon dioxide) used in semiconductor manufacturing processes which replaces the silicon dioxide gate dielectric. The implementation of high κ… …
9Microelectromechanical systems — (MEMS) (also written as micro electro mechanical, MicroElectroMechanical or microelectronic and microelectromechanical systems) is the technology of very small mechanical devices driven by electricity; it merges at the nano scale into… …
10Direct bonding — describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between two surfaces of any material possible meeting numerous requirements.[1] These requirements are specified for the… …
