polysilicon-gate process
31Microelectromechanical systems — (MEMS) (also written as micro electro mechanical, MicroElectroMechanical or microelectronic and microelectromechanical systems) is the technology of very small mechanical devices driven by electricity; it merges at the nano scale into… …
32Application-specific integrated circuit — An application specific integrated circuit (ASIC) is an integrated circuit (IC) customized for a particular use, rather than intended for general purpose use. For example, a chip designed solely to run a cell phone is an ASIC.In contrast, the… …
33Flash memory — Computer memory types Volatile RAM DRAM (e.g., DDR SDRAM) SRAM In development T RAM Z RAM TTRAM Historical Delay line memory Selectron tube Williams tube Non volatile …
3445 nanometer — Per the [http://www.itrs.net/reports.html International Technology Roadmap for Semiconductors] , the 45 nm technology node should refer to the average half pitch of a memory cell manufactured at around the 2007 2008 time frame.Matsushita and… …
35Physical verification — is a process whereby an IC layout design is checked via EDA software tools to see if it meets certain criteria. Verification involves DRC(Design rule check), LVS(Layout versus schematic), ERC (Electrical Rule Check), XOR (Exclusive OR), and… …
36Semiconductor device fabrication — Semiconductor manufacturing processes 10 µm 1971 3 µm 1975 1.5 µm 1982 …
37LOCOS-Prozess — LOCOS, kurz für englisch Local Oxidation of Silicon (dt. »lokale Oxidation von Silicium«, ist in der Halbleitertechnik ein Verfahren zur elektrischen Isolation von Bauelementen (meist Transistoren). Dafür wird der Silicium Wafer an… …
38Semiconductor device — Semiconductor devices are electronic components that exploit the electronic properties of semiconductor materials, principally silicon, germanium, and gallium arsenide. Semiconductor devices have replaced thermionic devices (vacuum tubes) in most …
39Integrated circuit design — Layout view of a simple CMOS Operational Amplifier ( inputs are to the left and the compensation capacitor is to the right ). The metal layers are colored blue and green, the polysilicon is red and vias are crosses. Integrated circuit design, or… …
40Microfabrication — Synthetic detail of a micromanufactured integrated circuit through four layers of planarized copper interconnect, down to the polysilicon (pink), wells (greyish) and substrate (green) Microfabrication is the term that describes processes of… …
