passivation layer
11Gold plating — is a method of depositing a thin layer of gold onto the surface of another metal, most often copper or silver, by chemical or electrochemical means.Mechanical or chemical affixing of thin gold foils onto the surface of objects is instead known as …
12Flux (metallurgy) — Rosin used as flux for soldering A flux pen used f …
13Zircaloy — Zircaloy, also incorrectly called zircalloy, is a group of high zirconium alloys. One of the main uses of zircaloys is in nuclear technology, as zirconium has very low absorption cross section of thermal neutrons and therefore it is frequently… …
14Molybdenum disilicide — IUPAC name Molybdenum disilicide Identifiers CAS number …
15Diffusion transistor — A diffusion transistor is any transistor formed by diffusing dopants into a semiconductor substrate. Diffusion transistors include some types of both bipolar junction transistors and field effect transistors. The diffusion process was developed… …
16Brazing — This article is about the metal joining process. For the cooking technique, see braising. Brazing practice Brazing is a metal joining process whereby a filler metal is heated above and distributed between two or more close fitting parts by… …
17Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… …
18Boron nitride — IUPAC name Boron nitride Identifiers …
19Silicon nitride — Preferred IUPAC name Silicon nitride …
20Aluminium oxide — Alumina redirects here. For the company, see Alumina Limited. This article is about aluminium(III) oxide Al2O3. For other uses, see Aluminium oxide (disambiguation). Aluminium oxide …
