metallization contact
1ohmic contact metallization — ominių kontaktų metalizavimas statusas T sritis radioelektronika atitikmenys: angl. ohmic contact metallization; ohmic metallization vok. Metallisierung von ohmschen Kontakten, f rus. металлизация омических контактов, f; омическая металлизация, f …
2ohmic metallization — ominių kontaktų metalizavimas statusas T sritis radioelektronika atitikmenys: angl. ohmic contact metallization; ohmic metallization vok. Metallisierung von ohmschen Kontakten, f rus. металлизация омических контактов, f; омическая металлизация, f …
3Metallic hydrogen — Some gas giants have metallic hydrogen in their centers Metallic hydrogen is a state of hydrogen which results when it is sufficiently compressed and undergoes a phase transition; it is an example of degenerate matter. Solid metallic hydrogen is… …
4Electromigration — is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between conducting electrons and diffusing metal atoms. The effect is important in applications where high direct current… …
5Power MOSFET — A Power MOSFET is a specific type of Metal Oxide Semiconductor Field Effect Transistor (MOSFET) designed to handle large power. Compared to the other power semiconductor devices (IGBT, Thyristor...), its main advantages are high commutation speed …
6Memristor — Type Passive Working principle Memristance Invented Leon Chua (1971) First production HP Labs (2008) Electronic symbol …
7printing — /prin ting/, n. 1. the art, process, or business of producing books, newspapers, etc., by impression from movable types, plates, etc. 2. the act of a person or thing that prints. 3. words, symbols, etc., in printed form. 4. printed material. 5.… …
8Mercury probe — The Mercury Probe is an electrical probing device to make rapid, non destructive contact to a sample for electrical characterization. Its primary application is semiconductor measurements where time consuming metallizations or photolithographic… …
9Direct bonding — describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between two surfaces of any material possible meeting numerous requirements.[1] These requirements are specified for the… …
10Flux (metallurgy) — Rosin used as flux for soldering A flux pen used f …
