memory package
71XScale — The XScale, a microprocessor core, is Intel s and Marvell s implementation of the ARMv5 architecture, and consists of several distinct families: IXP, IXC, IOP, PXA and CE (see more below). Intel sold the PXA family to Marvell Technology Group in… …
72Opteron — Produced From April 2003 to present Common manufacturer(s) AMD Max. CPU clock rate 1.4 GHz to 3.2 …
73SIMM — A SIMM, or single in line memory module, is a type of memory module containing random access memory used in computers from the early 1980s to the late 1990s. It differs from a dual in line memory module (DIMM), the most predominant form of memory …
74Honda Legend — This page is about this vehicle s Japanese model. See Acura Legend and Acura RL for information on the North American model. Sections of this article are translated from Japanese Wikipedia. Honda Legend …
75Windows Vista editions — This article is part of a series on Windows Vista New features Overview Technical and core system Security and safety Networking technologies I/O technologies Management and administration Removed features …
76System on a chip — The AMD Geode is an x86 compatible system on a chip A system on a chip or system on chip (SoC or SOC) is an integrated circuit (IC) that integrates all components of a computer or other electronic system into a single chip. It may contain digital …
77procfs — (or the proc filesystem) is a special filesystem in UNIX like operating systems that presents information about processes and other system information in a hierarchical file like structure, providing a more convenient and standardized method for… …
78DJMax Portable Black Square — Developer(s) Pentavision Publisher(s) …
79Prozessorgehäuse — ICs in DIP Gehäusen Die Ummantelung eines (ungehäusten) Halbleiterchips (ein sog. Die) inklusive der Anschlussstellen (Leads, Pins oder Balls) bezeichnet man als Gehäuse oder Package. Es existieren zahlreiche Variationen solcher Gehäuse, die sich …
80Schaltkreisgehäuse — ICs in DIP Gehäusen Die Ummantelung eines (ungehäusten) Halbleiterchips (ein sog. Die) inklusive der Anschlussstellen (Leads, Pins oder Balls) bezeichnet man als Gehäuse oder Package. Es existieren zahlreiche Variationen solcher Gehäuse, die sich …
