measurement probe
61Caliper — For other uses, see Caliper (disambiguation). A vernier caliper …
62Frequency domain sensor — Frequency domain (FD) sensor is an instrument developed for measuring soil moisture content. The instrument has an oscillating circuit, the sensing part of the sensor is embedded in the soil, and the operating frequency will depend on the value… …
63Age of the universe — The age of the universe is the time elapsed between the theory of the Big Bang and the present day. Current observations suggest that this is about 13.73 billion years, with an uncertainty of about +/ 120 million years. The lowering of the… …
64Scanning tunneling spectroscopy — (STS) is a powerful experimental technique in scanning tunneling microscopy (STM) that uses a scanning tunneling microscope (STM) to probe the local density of electronic states (LDOS) and band gap of surfaces and materials on surfaces at the… …
65Nanometrology — NIST Next Generation Nanometrology research.[1] Nanometrology is a subfield of metrology, concerned with the science of measurement at the nanoscale level. Nanometrology has a crucial role in order to produce nanomaterials and devices w …
66Modern searches for Lorentz violation — Important motivations for modern searches for Lorentz violation are deviations from Lorentz invariance (and thus special relativity) predicted by some variations of quantum gravity, string theory, and some alternatives to general relativity.… …
67Magnetic force microscope — MFM images of 3.2 GB and 30 GB computer hard drive surfaces. Magnetic force microscope (MFM) is a variety of atomic force microscope, where a sharp magnetized tip scans a magnetic sample; the tip sample magnetic interactions are detected and used …
68Roughness — is a measure of the texture of a surface. It is quantified by the vertical deviations of a real surface from its ideal form. If these deviations are large, the surface is rough; if they are small the surface is smooth. Roughness is typically… …
69Non-contact wafer testing — Wafer testing is a normal step in semiconductor device fabrication, used to detect defects in integrated circuits (IC) before they are assembled during the IC packaging step. Traditional (contact) wafer testing Probing ICs while they are still on …
70Tire uniformity — refers to the dynamic mechanical properties of pneumatic tires as strictly defined by a set of measurement standards and test conditions accepted by global tire and car makers. These measurement standards include the parameters of radial force… …
