kirkendall voiding

  • 1Gold-aluminium intermetallics — are intermetallic compounds of gold and aluminium that occur at contacts between the two metals. These intermetallics have different properties than the individual metals which can cause problems in wire bonding in microelectronics. The main… …

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  • 2Gold plating — is a method of depositing a thin layer of gold onto the surface of another metal, most often copper or silver, by chemical or electrochemical means.Mechanical or chemical affixing of thin gold foils onto the surface of objects is instead known as …

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