integrated-circuit substrate
91интегральная схема на КНД-структуре — integrinis silicio grandynas ant dielektriko statusas T sritis radioelektronika atitikmenys: angl. insulated substrate silicon integrated circuit; silicon on insulator integrated circuit vok. integrierter Silizium auf Dielektrikum Schaltkreis, m… …
92Nanotechnology — Part of a series of articles on …
93Mercury(II) cadmium(II) telluride — HgCdTe or mercury cadmium telluride (also cadmium mercury telluride, MCT or CMT) is an alloy of CdTe and HgTe and is sometimes claimed to be the third semiconductor of technological importance after silicon and gallium(III) arsenide. The amount… …
94Desoldering — Solders can be removed using a vacuum plunger (on the right) and a soldering iron. In electronics, desoldering is the removal of solder and components from a circuit for troubleshooting, for repair purposes, component replacement, and to salvage… …
95Perfboard — is a base for prototyping circuit boards. It has holes pre drilled at set intervals across a grid. Perfboard can be used for wire wrap prototypes and for solder prototypes. Copper or another metal can be plated onto the substrate in pre arranged… …
96Applied Materials — Infobox Company company name = Applied Materials, Inc. company company type = Public (NASDAQ: [http://quotes.nasdaq.com/asp/summaryquote.asp?symbol=AMAT%60 selected=AMAT%60 AMAT] ) company slogan = foundation = 1967 location = key people =… …
97Synthetic biology — is a new area of biological research that combines science and engineering. It encompasses a variety of different approaches, methodologies, and disciplines with a variety of definitions. What they all have in common, however, is that they see… …
98High Electron Mobility Transistor — HEMT stands for High Electron Mobility Transistor, and is also called heterostructure FET (HFET) or modulation doped FET (MODFET). A HEMT is a field effect transistor incorporating a junction between two materials with different band gaps (i.e. a …
99Wafer testing — is a step performed during semiconductor device fabrication. During this step, performed before a wafer is sent to die preparation, all individual integrated circuits that are present on the wafer are tested for functional defects by applying… …
100Planar process — The planar process is a manufacturing process used in the semiconductor industry to build individual components of a transistor, and in turn, connect those transistors together. It is the primary process by which modern integrated circuits are… …
