integrated-circuit substrate
71Microbolometer — A microbolometer is a specific type of bolometer used as a detector in a thermal camera. Infrared radiation with wavelengths between 7.5 14 μm strikes the detector material, heating it, and thus changing its electrical resistance. This resistance …
72P-n junction isolation — is a method used to electrically isolate electronic components, such as transistors, on an integrated circuit (IC) by surrounding the components with reverse biased p n junctions. Contents 1 Introduction 2 Operation 3 History 4 …
73IBM System/360 — The IBM System/360 (S/360) is a mainframe computer system family announced by IBM on April 7, 1964. It was the first family of computers making a clear distinction between architecture and implementation, allowing IBM to release a suite of… …
74Sputter deposition — is a physical vapor deposition (PVD) method of depositing thin films by sputtering, that is ejecting, material from a target, that is source, which then deposits onto a substrate, such as a silicon wafer. Resputtering is re emission of the… …
75Gallium arsenide — Gallium arsenide …
76Gallium(III) arsenide — Chembox new Name = Gallium arsenide ImageFile = Gallium arsenide.jpg ImageFile1 = Gallium arsenide unit cell 3D balls.png IUPACName = Gallium arsenide Section1 = Chembox Identifiers CASNo = 1303 00 0 SMILES = Ga#As Section2 = Chembox Properties… …
77Nanometrology — NIST Next Generation Nanometrology research.[1] Nanometrology is a subfield of metrology, concerned with the science of measurement at the nanoscale level. Nanometrology has a crucial role in order to produce nanomaterials and devices w …
78Quantum dot — Part of a series of articles on Nanomaterials Fullerenes …
79Silicon on sapphire — (SOS) is a hetero epitaxial process for integrated circuit manufacturing that consists of a thin layer (typically thinner than 0.6 micrometres) of silicon grown on a sapphire (Al2O3) wafer. SOS is part of the Silicon on Insulator (SOI) family of… …
80Surface micromachining — is a process used to produce micromachinery or MEMS.Unlike Bulk micromachining, where a silicon substrate (wafer) is selectively etched to produce structures, surface micromachining is based on the deposition and etching of different structural… …
