integrated-circuit substrate
121Nano-RAM — Computer memory types Volatile RAM DRAM (e.g., DDR SDRAM) SRAM In development T RAM Z RAM TTRAM Historical Delay line memory Selectron tube Williams tube Non volatile …
122QFN — A QFN or Quad Flat No leads or a MLF package is an integrated circuit package which falls under Surface mount technology packages used on printed circuit boards. This kind of package is similar to the Quad Flat Package, but the leads do not… …
123Molecular nanotechnology — Part of a series of articles on Molecular Nanotechnology …
124Alien Technology — Infobox Company company name = Alien Technology company vector company type = Private, venture funded genre = foundation = California 1994 founder = location city = Morgan Hill, California location country = United States location = origins = key …
125Die attachment — is the step during the integrated circuit packaging phase of semiconductor device fabrication during which a die is mounted and fixed to the package or support structure. For high powered applications, the die is usually eutectic bonded onto the… …
12665 nanometer — The 65 nanometer (65 nm) process is an advanced lithographic node used in volume CMOS semiconductor fabrication. Printed linewidths (i.e., transistor gate lengths) can reach as low as 25 nm on a nominally 65 nm process, while the pitch between… …
127Indium(III) oxide — Chembox new Name = Indium(III) oxide ImageName = Indium(III) oxide OtherNames = indium trioxide Section1 = Chembox Identifiers CASNo = 1312 43 2 Section2 = Chembox Properties Formula = In2O3 MolarMass = 277.64 g/mol Appearance = yellowish green… …
128Prozessorgehäuse — ICs in DIP Gehäusen Die Ummantelung eines (ungehäusten) Halbleiterchips (ein sog. Die) inklusive der Anschlussstellen (Leads, Pins oder Balls) bezeichnet man als Gehäuse oder Package. Es existieren zahlreiche Variationen solcher Gehäuse, die sich …
