integrated-circuit substrate
101Hewitt Crane — Hewitt D. Crane (1927, Jersey City, New Jersey June 17, 2008, Portola Valley, California) was an American engineer best known for his pioneering work at SRI International on ERMA (Electronic Recording Machine, Accounting), for Bank of America;… …
102D-37C — The D 37C is the computer component of the all inertial NS 17 Missile Guidance Set (MGS) for accurately navigating to its target thousands of miles away. The NS 17 MGS was used in the Minuteman II (LGM 30F) ICBM. The MGS, originally designed and… …
103Antenna effect — The antenna effect, more formally plasma induced gate oxide damage, is an effect that can potentially cause yield and reliability problems during the manufacture of MOS integrated circuits [ T. Watanabe, Y. Yoshida, “Dielectric Breakdown of Gate… …
104Polycrystalline silicon — Polycrystalline silicon, also called polysilicon, is a material consisting of small silicon crystals. It differs from single crystal silicon, used for electronics and solar cells, and from amorphous silicon, used for thin film devices and solar… …
105Electric double-layer capacitor — Maxwell Technologies MC and BC series supercapacitors (up to 3000 farad capacitance) An electric double layer capacitor (EDLC), also known as supercapacitor, supercondenser, electrochemical double layer capacitor, or ultracapacitor, is an… …
106Thermal management of high power LED — With the coming of energy saving era, high power light emitting diodes (LEDs) are promising to replace other technologies such as incandescent and fluorescent bulbs in signaling, solid state lighting, and vehicle headlight applications due to… …
107Hydrogen economy — The hydrogen economy is a proposed system of delivering energy using hydrogen. The term hydrogen economy was coined by John Bockris during a talk he gave in 1970 at General Motors (GM) Technical Center.[1] Hydrogen advocates promote hydrogen as… …
108Wafer dicing — is the process by which individual silicon chips or integrated circuits on a silicon wafer are separated following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing (normally with a …
109Photoplotter — A photoplotter is an electro mechanical optical machine that produces a latent image on a media, usually high contrast monochromatic (black and white) photographic film, using a light source under computer control.Photoplots are used primarily in …
110Stanford Smart Memories Project — Advances in VLSI technology now permit multiple processors to reside on a single integrated circuit chip, or IC. Such a processing system is known as a chip multiprocessor, or multi core CPU system. Building on this technology, the Stanford Smart …
