high-pressure bonding
1high-pressure phenomena — ▪ physics Introduction changes in physical, chemical, and structural characteristics that matter undergoes when subjected to high pressure. pressure thus serves as a versatile tool in materials research, and it is especially important in… …
2High voltage — The term high voltage characterizes electrical circuits, in which the voltage used is the cause of particular safety concerns and insulation requirements. High voltage is used in electrical power distribution, in cathode ray tubes, to generate X… …
3Pressure sensitive adhesive — (PSA, self adhesive, self stick adhesive) is adhesive that forms a bond when pressure is applied to marry the adhesive with the adherend. No solvent, water, or heat is needed to activate the adhesive.It is used in pressure sensitive tapes, labels …
4Ultra high molecular weight polyethylene — (UHMWPE), also known as high modulus polyethylene (HMPE) or high performance polyethylene (HPPE), is a subset of the thermoplastic polyethylene. It has extremely long chains, with molecular weight numbering in the millions, usually between 2 and… …
5Ultra-high-molecular-weight polyethylene — (UHMWPE or sometimes shortened to UHMW), also known as high modulus polyethylene (HMPE) or high performance polyethylene (HPPE), is a subset of the thermoplastic polyethylene. It has extremely long chains, with molecular weight numbering in the… …
6chemical bonding — ▪ chemistry Introduction any of the interactions that account for the association of atoms into molecules, ions, crystals, and other stable species that make up the familiar substances of the everyday world. When atoms approach one another …
7Direct bonding — describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between two surfaces of any material possible meeting numerous requirements.[1] These requirements are specified for the… …
8Human bonding — refers to the development of a close, interpersonal relationship between family members or friends. [ Webster’s New World College Dictionary © 1996.] Bonding is a mutual, interactive process, and is not the same as simple liking. The term is from …
9Ball bonding — is a type of wire bonding, and is the most common way to make the electrical interconnections between a microchip and the outside world as part of semiconductor device fabrication.Gold or copper wire can be used, though gold is more common… …
10Wire bonding — is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication.The wire is generally made up of one of the following: *Gold *Aluminum *CopperWire diameters start at 15 µm and can be up …
