grid array package

  • 11Staggered Pin Grid Array — A staggered pin grid array (SPGA) refers to a style of arranging pins on an integrated circuit package. It consists of two square arrays of pins, offset in both directions by half the minimum distance between pins in one of the arrays. Put… …

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  • 12Embedded Wafer Level Ball Grid Array — Prinzipskizze eWLB Embedded Wafer Level Ball Grid Array (eWLB) ist eine Gehäusebauform für integrierte Schaltungen, bei der die Gehäuseanschlüsse auf einem aus Chips und Vergussmasse künstlich hergestellten Wafer erzeugt werden. Inhaltsverze …

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  • 13Ceramic pin grid array — 133 MHz Pentium chip in a ceramic package You may be looking for Cornish Pilot Gig Association. CPGA stands for Ceramic Pin Grid Array, a type of packaging used by integrated circuits. This type of packaging uses a ceramic substrate with… …

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  • 14Land grid array — Socket 775 on a motherboard. The land grid array (LGA) is a type of surface mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket rather than the integrated circuit. An LGA can be electrically connected… …

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  • 15Organic pin grid array — An OPGA CPU. Note the brown colour many OPGA parts are coloured green. The die is in the centre of the device, and the four grey circles are foam spacers to relieve pressure caused by the heat sink from the die. The Organic Pin Grid Array (OPGA)… …

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  • 16Land grid array — Contenido 1 Concepto 2 Características 3 LGA en PC s personales y servidores 4 Lista de sockets para CPU s LGA …

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  • 17Flip-Chip Pin Grid Array — Eine 100 MHz Pentium CPU auf einem CPGA (IC auf der Unterseite) …

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  • 18Package on package — (PoP) is an integrated circuit packaging technique to allow vertically combining discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed on top of one another, i.e. stacked, with a standard interface to route… …

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  • 19Chip Scale Package — Ein Embedded Intel Pentium MMX in BGA Bauweise von unten gesehen. Gut zu erkennen sind die Lotperlen. Beidseitig bestückte Platine in BGA Technik …

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  • 20Dual in-line package — PDIP redirects here. PDIP may also refer to Indonesian Democratic Party – Struggle. Three 14 pin (DIP14) plastic dual in line packages containing IC chips …

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