front wafer surface
1Front-end of line — Die Mikroelektronik ist ein Teilgebiet der Elektrotechnik bzw. der Elektronik, das sich mit der Miniaturisierung von elektronischen Schaltungen befasst …
2Wafer (electronics) — Polished 12 and 6 silicon wafers. The flat cut into the right wafer indicates its doping and crystallographic orientation (see below) …
3Semiconductor device fabrication — Semiconductor manufacturing processes 10 µm 1971 3 µm 1975 1.5 µm 1982 …
4Depth of field — The area within the depth of field appears sharp, while the areas in front of and beyond the depth of field appear blurry …
5Solar cell — A solar cell made from a monocrystalline silicon wafer …
6Stepper — A stepper is a device used in the manufacture of integrated circuits (ICs) that is similar in operation to a slide projector or a photographic enlarger. Steppers are an essential part of the complex process, called photolithography, that creates… …
7Mikroelektronik — Die Mikroelektronik ist ein Teilgebiet der Elektronik, genauer der Halbleiterelektronik. Die Mikroelektronik beschäftigt sich mit dem Entwurf, der Entwicklung und der Herstellung von miniaturisierten, elektronischen Schaltungen, heute vor allem… …
8Laser diode — Top: a packaged laser diode shown with a penny for scale. Bottom: the laser diode chip is removed from the above package and placed on the eye of a needle for scale …
9materials science — the study of the characteristics and uses of various materials, as glass, plastics, and metals. [1960 65] * * * Study of the properties of solid materials and how those properties are determined by the material s composition and structure, both… …
10Etching (microfabrication) — Etching tanks used to perform Piranha, Hydrofluoric acid or RCA clean on 4 inch wafer batches at LAAS technological facility in Toulouse, France Etching is used in microfabrication to chemically remove layers from the surface of a wafer during… …
