electrically-conductive adhesive

  • 11Computer cooling — An OEM AMD heatsink mounted onto a motherboard. Computer cooling is required to remove the waste heat produced by computer components, to keep components within their safe operating temperature limits. Various cooling methods help to improve… …

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  • 12Flip chip — Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and MEMS, to external circuitry with solder bumps that have been deposited onto the chip pads …

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  • 13Occam Process — The Occam Process is a solder free, Restriction of Hazardous Substances Directive (RoHS) compliant method for use in the manufacturing of electronic circuit boards and was developed by Verdant Electronics. It combines the usual two steps of the… …

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  • 14Thermal grease — From left to right: Arctic Cooling MX 2 and MX 3, Tuniq TX 3, Cool Laboratory Liquid Metal Pro( Liquid Metal based), Shin Etsu MicroSi G751, Arctic Silver 5, Powdered Diamond. In background Arctic Silver grease remover …

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  • 15Quad-flat no-leads package — 28 pin QFN, upside down to show contacts and thermal/ground pad Flat no leads packages such as QFN (quad flat no leads) and DFN (dual flat no leads) physically and electrically connect integrated circuits to printed circuit boards. Flat no leads …

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  • 16Silicone rubber — is a polymer that has a backbone of silicon oxygen linkages, the same bond that is found in quartz, glass and sand. Normally, heat is required to vulcanise (set) the silicone rubber; this is normally carried out in a two stage process at the… …

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  • 17Nerve guidance conduit — A nerve guidance conduit (also referred to as an artificial nerve conduit or artificial nerve graft, as opposed to an autograft) is an artificial means of guiding axonal regrowth to facilitate nerve regeneration and is one of several clinical… …

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  • 18Soldering — For the song, see Soldering (song). For the product, see Solder. Desoldering a contact from a wire. Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal (solder) into the joint, the… …

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  • 19Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… …

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  • 20Spider-Man's powers and equipment — The fateful spider bite that gave Peter Parker his powers. Amazing Fantasy #15, art by Steve Ditko. Spider Man s powers, abilities, and equipment are used by Marvel Comics superhero Spider Man in tandem to combat his many foes. He receives most… …

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