chip attachment
1adhesive chip attachment — lusto priklijavimas statusas T sritis radioelektronika atitikmenys: angl. adhesive chip attachment; adhesive die attachment vok. Klebemontage, f rus. присоединение кристалла ИС клеем, n pranc. attachement adhésif, m; cohésion adhésive, f …
2Chip formation — The basic chip formation process. Chip formation is part of the process of cutting materials by mechanical means, using tools such as saws, lathes and milling cutters. An understanding of the theory and engineering of this formation is an… …
3chip bonding — lusto prijungimas statusas T sritis radioelektronika atitikmenys: angl. chip bonding; die attachment; die bonding vok. Chipbonden, n rus. присоединение кристалла ИС, n pranc. brochage de puce, m; connexion de puce, f …
4adhesive die attachment — lusto priklijavimas statusas T sritis radioelektronika atitikmenys: angl. adhesive chip attachment; adhesive die attachment vok. Klebemontage, f rus. присоединение кристалла ИС клеем, n pranc. attachement adhésif, m; cohésion adhésive, f …
5AT Attachment — Infobox connector name=AT Attachment with Packet Interface type=Internal storage device connector logo= caption=ATA connector on the left, with two motherboard ATA connectors on the right. designer=Western Digital, subsequently amended by many… …
6Flip chip — Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and MEMS, to external circuitry with solder bumps that have been deposited onto the chip pads …
7The Deadly Attachment — Dad s Army episode Episode no. Series Six Episode 054 Directed by David Croft Story by …
8The Final Attachment — Infobox Dad s Army episode number episode name=054 The Final Attachment script=Jimmy Perry and David Croft director=David Croft producer=David Croft recorded=Friday 22/6/73 original transmission=Wednesday 31/10/73 6.50pm series=Six length=30… …
9Die attachment — is the step during the integrated circuit packaging phase of semiconductor device fabrication during which a die is mounted and fixed to the package or support structure. For high powered applications, the die is usually eutectic bonded onto the… …
10Medium Attachment Unit — Two Medium Attachment Units or transceivers. (The units shown are backwards compatibility oriented 10BASET MAUs, not the more typical 10BASE5 MAUs; cf. article.) A Medium Attachment Unit (MAU) is a transceiver which converts signals on an… …
