chip's package
1Chip support package — (CSP) is a software set that contains chip specific software. A CSP usually includes peripheral device drivers and definition files. Categories: Integrated circuitsElectronics stubs …
2Chip scale package — A chip scale package (CSP) (sometimes, chip scale package with a hyphen) is a type of integrated circuit chip carrier. Originally, CSP was the acronym for chip size packaging. Since only a few packages are chip size, the meaning of the acronym… …
3Chip Scale Package — Ein Embedded Intel Pentium MMX in BGA Bauweise von unten gesehen. Gut zu erkennen sind die Lotperlen. Beidseitig bestückte Platine in BGA Technik …
4Package on package — (PoP) is an integrated circuit packaging technique to allow vertically combining discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed on top of one another, i.e. stacked, with a standard interface to route… …
5Chip carrier — A standard sized 8 pin dual in line package (DIP) containing a 555 timer IC. A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or… …
6Chip Taylor — Taylor at Wolverhampton, 2006 Background information Birth name James Wesley Voight Born March 21, 1940 …
7Package — can refer to:*Packaging and labelling *Mail item larger than a letter *Software package, in computing, a type of file format where software programs and installation material is grouped together **Java package, a concept programming where related …
8Chip's Challenge — Developer(s) Epyx Publisher(s) …
9Chip-Gehäuse — Chip Gehäuse, die Ummantelung eines Chips, welche dem Chip Schutz vor Beschädigungen bietet, an den vorgesehenen Platz auf einer Platine anpasst ist und ihn gewöhnlich über Pins, die Anschlüsse des Chips, an die Außenwelt anbindet. Bei… …
10Chip tridimensional (3D) — En electrónica, un circuito integrado tridimensional, o simplemente chip tridimensional (chip 3D), es un chip compuesto por dos o más capas de componentes electrónicos activos, integrados tanto vertical como horizontalmente, y formando un único… …
