adhesive bond
71Thermal management of high power LED — With the coming of energy saving era, high power light emitting diodes (LEDs) are promising to replace other technologies such as incandescent and fluorescent bulbs in signaling, solid state lighting, and vehicle headlight applications due to… …
72Dual in-line package — PDIP redirects here. PDIP may also refer to Indonesian Democratic Party – Struggle. Three 14 pin (DIP14) plastic dual in line packages containing IC chips …
73Typewriter — Mechanical desktop typewriters, such as this Underwood Five, were long time standards of government agencies, newsrooms, and offices …
74Laserdisc — Not to be confused with disk laser, a flat configuration solid state laser. Not to be confused with VCD, DVD, or Blu ray, optical disc formats employing digital video encoding. Not to be confused with CED, a coincident but incompatible analogue… …
75Die preparation — Wafer glued on blue tape and cut into pieces Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of 2 steps: wafer… …
76Optical fiber — A bundle of optical fibers A TOSLINK fiber optic audio c …
77Polyester resin — Unsaturated Polyester Resin. The term generally used for unsaturated (means containing chemical double bonds) resins formed by the reaction of dibasic organic acids and polyhydric alcohols, basic component of SMC/BMC.Unsaturated polyesters are… …
78bonding range — the time during which a satisfactory bond can be made. It is usually expressed in two numbers, the first number being the time in minutes one must wait after applying adhesive before trying to bond the surfaces, and the latter number being the… …
79Soldering — For the song, see Soldering (song). For the product, see Solder. Desoldering a contact from a wire. Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal (solder) into the joint, the… …
80Diamond-like carbon — A ta C thin film on silicon (15 mm diameter) exhibiting regions of 40 nm and 80 nm thickness …
