(silicon) chip
81Through-silicon via — (TSV) = In electronics, a through silicon via (TSV) is a vertical electrical connection passing completely through a silicon wafer or die. TSV technology is important in creating 3D packages and 3D integrated circuits. TSV technology in 3D… …
82Multi-Chip-Modul — Ein klassisches Multi Chip Modul (MCM, manchmal auch MCP von englisch Multi Chip Package) besteht aus mehreren einzelnen Mikrochips (bzw. Dice), die in einem gemeinsamen Gehäuse untergebracht sind und nach außen wie ein Chip aussehen, so… …
83nose on a chip — n. A computer chip with sensors that can detect chemicals associated with certain smells. Example Citation: Electronic aroma analyzers have also been used to test the quality of seafood, cheese, meat, coffee, beer, and wine, as well as a nose on… …
84Multi Project Chip — (MPC) or Multi Project Wafer (MPW) services integrate onto microelectronics wafers a number of different integrated circuit designs from various teams including designs from private firms, students and researchers from universities. Because IC… …
85Design of Systems on Silicon — (DS2) Former type Private Industry Semiconductor Devices Founded 1998 Defunct 2010 Headquarters Valencia, Spain …
86strained silicon — noun A layer of silicon atoms deposited onto a substrate of silicon germanium constrained to be wider apart than normal; this decreases resistance and increases performance when made into a chip …
87Flip-chip pin grid array — (FC PGA or FCPGA) is a form of pin grid array processor architecture package in which the die faces downwards on the top of the CPU with the back of the die exposed. This allows the die to have a more direct contact with the heatsink or other… …
88su|per|chip — «SOO puhr chihp», noun. a silicon computer chip that has thousands of components on it which can process large amounts of data at very high speed: »There have been two thrusts toward greater speed: the much discussed supeomputer and the less… …
89Through-Silicon-Via — Las TSV (Through Silicon Via) son vías de conexión verticales que atraviesan por completo, tanto obleas de silicio como superficies individuales de circuitos integrados (las denominadas “die” en inglés). La tecnología de creación de TSVs es… …
90Strained Silicon — [dt. »gestrecktes Silicium«], erstmals im Juni 2001 von IBM offiziell vorgestellte Herstellungsmethode für integrierte Schaltkreise, die eine bis zu 35 Prozent höhere Leistung als bei herkömmlichen Computer Chips verspricht, ohne dass die… …
