(chemical mechanical planarization or polishing)
1Chemical-mechanical planarization — Chemical Mechanical Polishing/Planarization is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing. Contents 1 Description 2… …
2Chemical Mechanical Polishing — Chemisch mechanisches Polieren (CMP) (engl: chemical mechanical polishing, auch chemical mechanical planarization) ist ein Polierverfahren in der Waferbearbeitung um sehr dünne Schichten gleichmäßig abzutragen. Diese Methode wurde an US… …
3Polishing — is the process of creating a smooth and shiny surface by using rubbing or a chemical action, leaving a surface with significant specular reflection and minimal diffuse reflection. Imagine the surface magnified thousands of times, it usually looks …
4CMP — can be an acronym or abbreviation for: Contents 1 Medicine 2 Military and firearms 3 Science and technology 3.1 Computing …
5Surface finishing — is a broad range of industrial processes that alter the surface of a manufactured item to achieve a certain property.[1] Finishing processes may be employed to: improve appearance, adhesion or wettability, solderability, corrosion resistance,… …
6Chemisch-mechanisches Polieren — Chemisch mechanisches Polieren, auch chemisch mechanisches Planarisieren (CMP, engl: chemical mechanical polishing, auch chemical mechanical planarization) ist ein Polierverfahren in der Waferbearbeitung um dünne Schichten gleichmäßig abzutragen …
7Microfabrication — Synthetic detail of a micromanufactured integrated circuit through four layers of planarized copper interconnect, down to the polysilicon (pink), wells (greyish) and substrate (green) Microfabrication is the term that describes processes of… …
8Copper-based chips — are semiconductor integrated circuits, usually microprocessors, which use copper for interconnections. Since copper is a better conductor than aluminium, chips using this technology can have smaller metal components, and use less energy to pass… …
9Shallow trench isolation — (STI), also known as Box Isolation Technique , is an integrated circuit feature which prevents electrical current leakage between adjacent semiconductor device components. STI is generally used on CMOS process technology nodes of 250 nanometers… …
10Chemisch-mechanische Politur — Chemisch mechanisches Polieren (CMP) (engl: chemical mechanical polishing, auch chemical mechanical planarization) ist ein Polierverfahren in der Waferbearbeitung um sehr dünne Schichten gleichmäßig abzutragen. Diese Methode wurde an US… …
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