- ion-beam sputter deposition
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ионно-лучевое напыление; ионно-лучевое осаждение
Англо-русский словарь технических терминов. 2005.
ion-beam sputter deposition
Смотреть что такое "ion-beam sputter deposition" в других словарях:
Ion beam deposition — (IBD) is a process of applying materials to a target through the application of an ion beam.In an ion source source materials gases or evaporated solids are ionized using electron ionization or by application of high electric fields (Penning ion… … Wikipedia
Sputter deposition — is a physical vapor deposition (PVD) method of depositing thin films by sputtering, that is ejecting, material from a target, that is source, which then deposits onto a substrate, such as a silicon wafer. Resputtering is re emission of the… … Wikipedia
Focused ion beam — Focused ion beam, also known as FIB, is a technique used particularly in the semiconductor and materials science fields for site specific analysis, deposition, and ablation of materials. The FIB is a scientific instrument that resembles a… … Wikipedia
Sputter — Das Sputtern (aus dem englischen to sputter = zerstäuben) – oder auf deutsch, die Kathodenzerstäubung – ist ein physikalischer Vorgang, bei dem Atome aus einem Festkörper (Target) durch Beschuss mit energiereichen Ionen (vorwiegend Edelgasionen)… … Deutsch Wikipedia
Ion plating — is a physical vapor deposition (PVD) process that is sometimes called ion assisted deposition (IAD) or ion vapor deposition (IVD) and is a version of vacuum deposition . Ion plating utilizes concurrent or periodic bombardment of the substrate and … Wikipedia
Ion source — An ion source is an electro magnetic device that is used to create charged particles. These are used primarily within mass spectrometers or particle accelerators.Mass spectrometry In mass spectrometry, an ion source is a piece of equipment used… … Wikipedia
Pulsed laser deposition — (PLD) is a thin film deposition (specifically a physical vapor deposition, PVD) technique where a high power pulsed laser beam is focused inside a vacuum chamber to strike a target of the desired composition. Material is then vaporized from the… … Wikipedia
Plasma-enhanced chemical vapor deposition — PECVD machine at LAAS technological facility in Toulouse, France. Plasma enhanced chemical vapor deposition (PECVD) is a process used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Chemical reactions are involved… … Wikipedia
Electron beam lithography — (often abbreviated as e beam lithography) is the practice of scanning a beam of electrons in a patterned fashion across a surface covered with a film (called the resist),cite book |last= McCord |first=M. A. |coauthors=M. J. Rooks |title=… … Wikipedia
Deep reactive-ion etching — (DRIE) is a highly anisotropic etch process used to create deep penetration, steep sided holes and trenches in wafers, with aspect ratios of 20:1 or more. It was developed for microelectromechanical systems (MEMS), which require these features,… … Wikipedia
Sputtern — Das Sputtern (aus dem Englischen to sputter = zerstäuben) – oder auf deutsch, die Kathodenzerstäubung – ist ein physikalischer Vorgang, bei dem Atome aus einem Festkörper (Target) durch Beschuss mit energiereichen Ionen (vorwiegend… … Deutsch Wikipedia
