- hybrid(-circuit) packaging
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сборка ГИС
Англо-русский словарь технических терминов. 2005.
hybrid(-circuit) packaging
Смотреть что такое "hybrid(-circuit) packaging" в других словарях:
hybrid packaging — hibridinio grandyno surinkimas į korpusą statusas T sritis radioelektronika atitikmenys: angl. hybrid packaging vok. Hybridschaltungsverkappung, f rus. сборка гибридной схемы в корпус, f pranc. encapsulation de circuit hybride, f … Radioelektronikos terminų žodynas
Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… … Wikipedia
Printed circuit board — Part of a 1983 Sinclair ZX Spectrum computer board; a populated PCB, showing the conductive traces, vias (the through hole paths to the other surface), and some mounted electrical components A printed circuit board, or PCB, is used to… … Wikipedia
Electronic packaging — is a major discipline within the field of electronic engineering, and includes a wide variety of technologies. It refers to enclosures and protective features built into the product itself, and not to shipping containers. It applies both to end… … Wikipedia
Application-specific integrated circuit — An application specific integrated circuit (ASIC) is an integrated circuit (IC) customized for a particular use, rather than intended for general purpose use. For example, a chip designed solely to run a cell phone is an ASIC.In contrast, the… … Wikipedia
Integrated Circuit — Integrierter Schaltkreis. Das Chip Gehäuse wurde geöffnet und ermöglicht den Blick auf den eigentlichen Halbleiter. Die erkennbaren Strukturen im Zentrum sind die realisierte elektronische Schaltung. Im Außenbereich sind die goldenen… … Deutsch Wikipedia
encapsulation de circuit hybride — hibridinio grandyno surinkimas į korpusą statusas T sritis radioelektronika atitikmenys: angl. hybrid packaging vok. Hybridschaltungsverkappung, f rus. сборка гибридной схемы в корпус, f pranc. encapsulation de circuit hybride, f … Radioelektronikos terminų žodynas
IBM Solid Logic Technology — Solid Logic Technology (SLT) was IBM s method for packaging electronic circuitry introduced in 1964 with the IBM System/360 series and related machines. IBM chose to design custom hybrid circuits using discrete, flip chip mounted, glass… … Wikipedia
Field-programmable gate array — FPGAs should not be confused with the flip chip pin grid array, a form of integrated circuit packaging. A field programmable gate array is a semiconductor device containing programmable logic components called logic blocks , and programmable… … Wikipedia
environment — environmental, adj. environmentally, adv. /en vuy reuhn meuhnt, vuy euhrn /, n. 1. the aggregate of surrounding things, conditions, or influences; surroundings; milieu. 2. Ecol. the air, water, minerals, organisms, and all other external factors… … Universalium
Diffusion of technology in Canada — This article outlines the history of the diffusion or spread of technology in Canada. Technologies chosen for treatment here include, in rough order, transportation, communication, energy, materials, industry, public works, public services… … Wikipedia
