gold ball bonder

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Ball bonding — is a type of wire bonding, and is the most common way to make the electrical interconnections between a microchip and the outside world as part of semiconductor device fabrication.Gold or copper wire can be used, though gold is more common… … Wikipedia
List of Historic Mechanical Engineering Landmarks — The following is a list of Historic Mechanical Engineering Landmarks as designated by the American Society of Mechanical Engineers since it began the program in 1971. The designation is granted to existing artifacts or systems representing a… … Wikipedia
Jämtland — Coat of arms … Wikipedia

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