- chip-carrier package
-
кристаллоноситель; кристаллодержатель
Англо-русский словарь технических терминов. 2005.
chip-carrier package
Смотреть что такое "chip-carrier package" в других словарях:
Chip scale package — A chip scale package (CSP) (sometimes, chip scale package with a hyphen) is a type of integrated circuit chip carrier. Originally, CSP was the acronym for chip size packaging. Since only a few packages are chip size, the meaning of the acronym… … Wikipedia
Chip carrier — A standard sized 8 pin dual in line package (DIP) containing a 555 timer IC. A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or… … Wikipedia
Plastic leaded chip carrier — A Plastic Leaded Chip Carrier (PLCC) is a four sided “J” leaded plastic integrated circuit package with pin spacings of 0.05 (1.27 mm). Lead counts range from 20 to 84. PLCC packages can be square or rectangular. Body widths range from .35 to… … Wikipedia
Leadless chip carrier — A leadless chip carrier (LCC) is a type of packaging for integrated circuits which has no leads , but instead rounded pins through the edges of the ceramic package. See also * Plastic leaded chip carrier * Ceramic Leadless chip carrier … Wikipedia
Plastic leaded chip carrier — Microcontrolador Motorola MC68HC711E9CFN3 en encapsulado QFJ52 (PLCC52) … Wikipedia Español
Package — can refer to:*Packaging and labelling *Mail item larger than a letter *Software package, in computing, a type of file format where software programs and installation material is grouped together **Java package, a concept programming where related … Wikipedia
Dual in-line package — PDIP redirects here. PDIP may also refer to Indonesian Democratic Party – Struggle. Three 14 pin (DIP14) plastic dual in line packages containing IC chips … Wikipedia
Quad-flat no-leads package — 28 pin QFN, upside down to show contacts and thermal/ground pad Flat no leads packages such as QFN (quad flat no leads) and DFN (dual flat no leads) physically and electrically connect integrated circuits to printed circuit boards. Flat no leads … Wikipedia
Multi-chip module — POWER5 MCM with four processors and four 36 MB external L3 cache dies on a ceramic multi chip module. A multi chip module (MCM) is a specialized electronic package where multiple integrated circuits (ICs), semiconductor dies or other discrete… … Wikipedia
Quad Flat Package — 44 poliges QFP (ein Mikroprozessor Z80) Quad Flat Package (QFP) bezeichnet in der Elektronik eine weit verbreitete Gehäusebauform für Integrierte Schaltungen. Die Anschlüsse (Pins) befinden sich an den vier Seiten des flachen Gehäuses. QFP werden … Deutsch Wikipedia
Quad Flat Package — Saltar a navegación, búsqueda Un Z80 en formato QFP de 44 pines (variante LQFP). Un encapsulado Quad Flat Package (QFP o encapsulado cuadrado plano) es un encapsulado de circuito integrado para montaje superficial con los conectores de… … Wikipedia Español
