- chip bump
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столбиковый вывод (полупроводникового) кристалла
Англо-русский словарь технических терминов. 2005.
chip bump
Смотреть что такое "chip bump" в других словарях:
flip-chip bump — gūburinis apverstojo lusto išvadas statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f … Radioelektronikos terminų žodynas
Bump mapping — is a computer graphics technique where at each pixel, a perturbation to the surface normal of the object being rendered is looked up in a heightmap and applied before the illumination calculation is done (see, for instance, Phong shading). The… … Wikipedia
Chip carrier — A standard sized 8 pin dual in line package (DIP) containing a 555 timer IC. A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or… … Wikipedia
Flip-Chip-Höcker — gūburinis apverstojo lusto išvadas statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f … Radioelektronikos terminų žodynas
poutre de flip-chip — gūburinis apverstojo lusto išvadas statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f … Radioelektronikos terminų žodynas
Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… … Wikipedia
Flip chip — Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and MEMS, to external circuitry with solder bumps that have been deposited onto the chip pads … Wikipedia
gūburinis apverstojo lusto išvadas — statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f … Radioelektronikos terminų žodynas
poutre de cristal inverse — gūburinis apverstojo lusto išvadas statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f … Radioelektronikos terminų žodynas
столбиковый вывод перевёрнутого кристалла ИС — gūburinis apverstojo lusto išvadas statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f … Radioelektronikos terminų žodynas
Ultratech, Inc. — Ultratech, Inc. nasdaq|UTEK is a publicly traded international technology company based in San Jose, California which supplies equipment to global semiconductor fabs and foundries, and also makes industry leading tools for nanotechnology… … Wikipedia
