solder-dipped lead

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Solder paste — (or solder cream) is used for connecting the terminations of the IC packages with that of land patterns on the PCB. The paste is applied to the lands by printing the solder using a stencil, while other methods like screening and dispensing are… … Wikipedia
Dip soldering — apparatus. Dip soldering is a small scale soldering process by which electronic components are soldered to a printed circuit board (PCB) to form an electronic assembly. The solder wets to the exposed metallic areas of the board (those not… … Wikipedia
tin processing — Introduction preparation of the ore for use in various products. Tin (Sn) is a relatively soft and ductile metal with a silvery white colour. It has a density of 7.29 grams per cubic centimetre, a low melting point of 231.88° C… … Universalium
Glass-to-metal seal — Glass to metal seals are a very important element of the construction of vacuum tubes, electric discharge tubes, incandescent light bulbs, glass encapsulated semiconductor diodes, reed switches, pressure tight glass windows in metal cases, and… … Wikipedia
Brazing — This article is about the metal joining process. For the cooking technique, see braising. Brazing practice Brazing is a metal joining process whereby a filler metal is heated above and distributed between two or more close fitting parts by… … Wikipedia

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