- printed-wiring substrate
-
подложка с печатными соединениями
Англо-русский словарь технических терминов. 2005.
printed-wiring substrate
Смотреть что такое "printed-wiring substrate" в других словарях:
Printed circuit board — Part of a 1983 Sinclair ZX Spectrum computer board; a populated PCB, showing the conductive traces, vias (the through hole paths to the other surface), and some mounted electrical components A printed circuit board, or PCB, is used to… … Wikipedia
printed circuit — Electronics. a circuit in which the interconnecting conductors and some of the circuit components have been printed, etched, etc., onto a sheet or board of dielectric material (PC board, printed circuit board). [1945 50] * * * Electrical device… … Universalium
подложка с печатными соединениями — — [Я.Н.Лугинский, М.С.Фези Жилинская, Ю.С.Кабиров. Англо русский словарь по электротехнике и электроэнергетике, Москва, 1999 г.] Тематики электротехника, основные понятия EN printed wiring substrate … Справочник технического переводчика
Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… … Wikipedia
radio — /ray dee oh /, n., pl. radios, adj., v., radioed, radioing. n. 1. wireless telegraphy or telephony: speeches broadcast by radio. 2. an apparatus for receiving or transmitting radio broadcasts. 3. a message transmitted by radio. adj. 4. pertaining … Universalium
ГОСТ 20406-75: Платы печатные. Термины и определения — Терминология ГОСТ 20406 75: Платы печатные. Термины и определения оригинал документа: 12. Аддитивный процесс Процесс получения проводящих рисунков, заключающийся в избирательном осаждении проводникового материала на нефольгированный материал… … Словарь-справочник терминов нормативно-технической документации
Conformal coating — material is applied to electronic circuitry to act as protection against moisture, dust, chemicals, and temperature extremes that, if uncoated (non protected), could result in damage or failure of the electronics to function. When electronics… … Wikipedia
Die attachment — is the step during the integrated circuit packaging phase of semiconductor device fabrication during which a die is mounted and fixed to the package or support structure. For high powered applications, the die is usually eutectic bonded onto the… … Wikipedia
MicroLeadFrame — package Amkor s MicroLeadFrame (QFN Quad Flat No Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the (PWB… … Wikipedia
Solar cell — A solar cell made from a monocrystalline silicon wafer … Wikipedia
Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… … Wikipedia
