vacuum metallization

vacuum metallization
металлизация в вакууме, вакуумная металлизация

Большой англо-русский и русско-английский словарь. 2001.

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  • vacuum metallization — vakuuminis metalizavimas statusas T sritis radioelektronika atitikmenys: angl. vacuum metallization vok. Metallverdampfung, f rus. вакуумная металлизация, f pranc. métallisation sous vide, f …   Radioelektronikos terminų žodynas

  • Metallverdampfung — vakuuminis metalizavimas statusas T sritis radioelektronika atitikmenys: angl. vacuum metallization vok. Metallverdampfung, f rus. вакуумная металлизация, f pranc. métallisation sous vide, f …   Radioelektronikos terminų žodynas

  • métallisation sous vide — vakuuminis metalizavimas statusas T sritis radioelektronika atitikmenys: angl. vacuum metallization vok. Metallverdampfung, f rus. вакуумная металлизация, f pranc. métallisation sous vide, f …   Radioelektronikos terminų žodynas

  • vakuuminis metalizavimas — statusas T sritis radioelektronika atitikmenys: angl. vacuum metallization vok. Metallverdampfung, f rus. вакуумная металлизация, f pranc. métallisation sous vide, f …   Radioelektronikos terminų žodynas

  • вакуумная металлизация — vakuuminis metalizavimas statusas T sritis radioelektronika atitikmenys: angl. vacuum metallization vok. Metallverdampfung, f rus. вакуумная металлизация, f pranc. métallisation sous vide, f …   Radioelektronikos terminų žodynas

  • Memristor — Type Passive Working principle Memristance Invented Leon Chua (1971) First production HP Labs (2008) Electronic symbol …   Wikipedia

  • Michael Francis Tompsett — is a British born physicist and former researcher at English Electric Valve Company, [1] who later moved to Bell Labs in America. He is best known as the inventor of Charge Coupled Device (CCD) Imagers used for imaging in devices such as digital… …   Wikipedia

  • Evaporation (deposition) — Evaporation machine used for metallization at LAAS technological facility in Toulouse, France. Evaporation is a common method of thin film deposition. The source material is evaporated in a vacuum. The vacuum allows vapor particles to travel… …   Wikipedia

  • Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… …   Wikipedia

  • Metallizing — is the general name for the technique of coating metal on the surface of non metallic objects. Techniques for metallization started as early as mirror making. In 1835, Justus von Liebig discovered the process of coating a glass surface with… …   Wikipedia

  • Direct bonding — describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between two surfaces of any material possible meeting numerous requirements.[1] These requirements are specified for the… …   Wikipedia


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