thermal reflow
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Reflow soldering — is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily hold the components to their attachment pads, after which the assembly is carefully heated in order to solder the joint. The assembly may… … Wikipedia
Thermal Pad — Thermal Pads in die großflächige, in grün dargestellte, Kupferfläche … Deutsch Wikipedia
Reflow oven — A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards.Types of Reflow Ovens Infrared and Convection Ovens The oven contains multiple zones, which can be individually… … Wikipedia
Thermal management of electronic devices and systems — Heat generated by electronic devices and circuitry must be dissipated to improve reliability and prevent premature failure. Techniques for heat dissipation can include heatsinks and fans for air cooling, and other forms of computer cooling such… … Wikipedia
Thermal Via — Eine Leiterplatte (auch Leiterkarte, Platine) ist ein Träger aus isolierendem Material mit festhaftenden leitenden Verbindungen. Sie dient der mechanischen Befestigung und elektrischen Verbindung elektronischer Bauteile. Oben: Bestückungsseite… … Deutsch Wikipedia
Thermal Vias — Eine Leiterplatte (auch Leiterkarte, Platine) ist ein Träger aus isolierendem Material mit festhaftenden leitenden Verbindungen. Sie dient der mechanischen Befestigung und elektrischen Verbindung elektronischer Bauteile. Oben: Bestückungsseite… … Deutsch Wikipedia
Rapid thermal processing — (or RTP) refers to a semiconductor manufacturing process which heats silicon wafers to high temperatures (up to 1200 C or greater) on a timescale of several seconds or less. The wafers must be brought down (temperature) slow enough however, so… … Wikipedia
Multiple patterning — is a class of technologies developed for photolithography to enhance the feature density. The simplest case of multiple patterning is double patterning, where a conventional lithography process is enhanced to produce double the expected number of … Wikipedia
Double patterning — is a class of technologies developed for photolithography to enhance the feature density. For the semiconductor industry, double patterning is the only lithography technique to be used for the 32 nm and 22 nm half pitch nodes in 2008 2009 and… … Wikipedia
Soldering — For the song, see Soldering (song). For the product, see Solder. Desoldering a contact from a wire. Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal (solder) into the joint, the… … Wikipedia
Surface-mount technology — (SMT) is a method for constructing electronic circuits in which the components (SMC, or Surface Mounted Components) are mounted directly onto the surface of printed circuit boards (PCBs). Electronic devices so made are called surface mount… … Wikipedia
