- silicon backing wafer
- кремниевая пластина-носитель
Большой англо-русский и русско-английский словарь. 2001.
Большой англо-русский и русско-английский словарь. 2001.
Wafer dicing — is the process by which individual silicon chips or integrated circuits on a silicon wafer are separated following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing (normally with a … Wikipedia
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Photovoltaic module — In the field of photovoltaics, a photovoltaic module is a packaged interconnected assembly of photovoltaic cells, also known as solar cells. An installation of photovoltaic modules or panels is known as a photovoltaic array or a solar panel.… … Wikipedia
radiation measurement — ▪ technology Introduction technique for detecting the intensity and characteristics of ionizing radiation, such as alpha, beta, and gamma rays or neutrons, for the purpose of measurement. The term ionizing radiation refers to those… … Universalium
Diamond tool — A close up of the segment of a diamond saw blade A diamond tool is a cutting tool with diamond grains fixed on the functional parts of the tool via a bonding material or another method.[1] As diamond is a superhard material, diamond tools have… … Wikipedia
Fairchild Semiconductor — Infobox Company name = Fairchild Semiconductor International, Inc. type = Public (NYSE: [http://finance.google.com/finance?q=NYSE:FCS FCS] ) genre = foundation = 1957 / 1997 founder = location = South Portland, Maine United States locations =… … Wikipedia