- pin-grid package
- корпус с матричным расположением выводов;
матричный многоштырьковый корпус
Большой англо-русский и русско-английский словарь. 2001.
pin-grid package
Смотреть что такое "pin-grid package" в других словарях:
Pin grid array — del Motorola XC68020. El pin grid array o PGA es un tipo de empaquetado usado para los circuitos integrados, particularmente microprocesadores. Originalmente el PGA, el zócalo clásico para la inserción en una placa base de un microprocesador, fue … Wikipedia Español
Pin grid array — A pin grid array, often abbreviated PGA, refers to the arrangement of pins on the integrated circuit packaging. In a PGA, the pins are arranged in a square array that may or may not cover the bottom of the package. The pins are commonly spaced… … Wikipedia
pin grid array package — korpusas su matriciniais išvadais statusas T sritis radioelektronika atitikmenys: angl. pin grid array package vok. Gehäuse mit Anschlußstiftmatrix, n rus. корпус с матричным расположением выводов, m; матричный корпус, m pranc. boîtier fakir, m … Radioelektronikos terminų žodynas
Flip-chip pin grid array — (FC PGA or FCPGA) is a form of pin grid array processor architecture package in which the die faces downwards on the top of the CPU with the back of the die exposed. This allows the die to have a more direct contact with the heatsink or other… … Wikipedia
Staggered Pin Grid Array — A staggered pin grid array (SPGA) refers to a style of arranging pins on an integrated circuit package. It consists of two square arrays of pins, offset in both directions by half the minimum distance between pins in one of the arrays. Put… … Wikipedia
Ceramic pin grid array — 133 MHz Pentium chip in a ceramic package You may be looking for Cornish Pilot Gig Association. CPGA stands for Ceramic Pin Grid Array, a type of packaging used by integrated circuits. This type of packaging uses a ceramic substrate with… … Wikipedia
Organic pin grid array — An OPGA CPU. Note the brown colour many OPGA parts are coloured green. The die is in the centre of the device, and the four grey circles are foam spacers to relieve pressure caused by the heat sink from the die. The Organic Pin Grid Array (OPGA)… … Wikipedia
Flip-Chip Pin Grid Array — Eine 100 MHz Pentium CPU auf einem CPGA (IC auf der Unterseite) … Deutsch Wikipedia
Ball grid array — For other uses, see BGA (disambiguation). Intel Embedded Pentium MMX (bottom view) A ball grid array (BGA) is a type of surface mount packaging used for integrated circuits. Contents … Wikipedia
Dual in-line package — PDIP redirects here. PDIP may also refer to Indonesian Democratic Party – Struggle. Three 14 pin (DIP14) plastic dual in line packages containing IC chips … Wikipedia
Chip Scale Package — Ein Embedded Intel Pentium MMX in BGA Bauweise von unten gesehen. Gut zu erkennen sind die Lotperlen. Beidseitig bestückte Platine in BGA Technik … Deutsch Wikipedia
