copper substrate

copper substrate
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Большой англо-русский и русско-английский словарь. 2001.

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  • Copper indium gallium selenide solar cells — Copper indium gallium selenide (CuIn1 xGaxSe2 or CIGS) is a direct bandgap semiconductor useful for the manufacture of solar cells. Because the material strongly absorbs sunlight, a much thinner film is required than of other semiconductor… …   Wikipedia

  • Copper Redhorse — Conservation status Vulnerable (IUCN 2.3) Scientific classification Kingdom …   Wikipedia

  • Copper pour — on a printed circuit board flowing around tracks and pads …   Wikipedia

  • Copper in health — Normal absorption and distribution of copper. Cu = copper, CP = ceruloplasmin, green = ATP7B carrying copper. Copper is an essential trace element that is vital to the health of all living things (humans, plants, animals, and microorganisms). In… …   Wikipedia

  • Power electronic substrate — The role of the substrate in power electronics is to provide the interconnections to form an electric circuit (like a printed circuit board), and to cool the components. Compared to materials and techniques used in lower power microelectronics,… …   Wikipedia

  • Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… …   Wikipedia

  • Direct Bonded Copper — Struktur eines Direct Bonded Copper Substrates (oben) und eines isolierten Metal Substrates (unten). Direct bonded copper, (DBC, auch engl. Direct copper bonded, DCB), ist in der Aufbau und Verbindungstechnik eine spezielle Halbleiter Struktur,… …   Deutsch Wikipedia

  • Zinc-copper couple — is an alloy of zinc and copper that is employed as a reagent in organic synthesis. The “couple” was popularized after the report by Simmons and Smith in 1959 of its application as an activated source of zinc required for formation of an… …   Wikipedia

  • Yttrium barium copper oxide — IUPAC name barium copper yttrium oxide …   Wikipedia

  • electronic substrate and package ceramics — Introduction       advanced industrial materials that, owing to their insulating qualities, are useful in the production of electronic components.       Modern electronics are based on the integrated circuit, an assembly of millions of… …   Universalium

  • Plating — describes surface covering where a metal is deposited on a conductive surface. Plating has been done for hundreds of years, but it is also critical for modern technology. Plating is used to decorate objects, for corrosion inhibition, to improve… …   Wikipedia


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