wafer processing
1wafer processing — plokštelių apdorojimas statusas T sritis radioelektronika atitikmenys: angl. wafer processing vok. Waferbearbeitung, f rus. обработка пластин, f pranc. traitement des tranches, m …
2wafer processing efficiency — plokštelių apdirbimo našumas statusas T sritis radioelektronika atitikmenys: angl. wafer processing efficiency; wafer throughput rate vok. Waferdurchsatzrate, f rus. производительность обработки пластин, f pranc. rendement de traitement des… …
3wafer-processing equipment — plokštelės apdirbimo įranga statusas T sritis radioelektronika atitikmenys: angl. wafer processing equipment vok. Waferbearbeitungsausrüstung, f rus. оборудование для технологической обработки пластин, n pranc. équipement pour le traitement… …
4silicon wafer processing — silicio plokštelių apdirbimo technologija statusas T sritis radioelektronika atitikmenys: angl. silicon wafer engineering; silicon wafer processing vok. Siliziumwaferverarbeitungstechnik, f rus. технология обработки кремниевых пластин, f pranc.… …
5single-wafer processing — nuoseklusis plokštelių apdorojimas statusas T sritis radioelektronika atitikmenys: angl. single wafer processing vok. Einzelwaferbearbeitung, f rus. последовательная обработка пластин, f pranc. traitement séquentiel des tranches, m …
6wafer throughput rate — plokštelių apdirbimo našumas statusas T sritis radioelektronika atitikmenys: angl. wafer processing efficiency; wafer throughput rate vok. Waferdurchsatzrate, f rus. производительность обработки пластин, f pranc. rendement de traitement des… …
7Wafer-scale integration — Wafer scale integration, WSI for short, is a yet unused system of building very large integrated circuit networks that use an entire silicon wafer to produce a single super chip . Through a combination of large size and reduced packaging, WSI… …
8wafer chip — wafer chip, an electronic silicon wafer provided with a microcircuitry equal to the power of a hundred or more microchips: »Because processing video images takes so much memory and computer power, image processing could be the main nearterm… …
9Wafer dicing — is the process by which individual silicon chips or integrated circuits on a silicon wafer are separated following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing (normally with a …
10Wafer (electronics) — Polished 12 and 6 silicon wafers. The flat cut into the right wafer indicates its doping and crystallographic orientation (see below) …
