solder bump
1solder bump lead — lydmetalinis gūburinis išvadas statusas T sritis radioelektronika atitikmenys: angl. solder bump lead; solder bump pad vok. Lötkontakthügel, m rus. столбиковый вывод из припоя, m pranc. poutre de brasure, m …
2solder bump pad — lydmetalinis gūburinis išvadas statusas T sritis radioelektronika atitikmenys: angl. solder bump lead; solder bump pad vok. Lötkontakthügel, m rus. столбиковый вывод из припоя, m pranc. poutre de brasure, m …
3solder bump — noun A small sphere of solder used as a connection between devices and a printed circuit board …
4Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… …
5Flip chip — Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and MEMS, to external circuitry with solder bumps that have been deposited onto the chip pads …
6Lötkontakthügel — lydmetalinis gūburinis išvadas statusas T sritis radioelektronika atitikmenys: angl. solder bump lead; solder bump pad vok. Lötkontakthügel, m rus. столбиковый вывод из припоя, m pranc. poutre de brasure, m …
7lydmetalinis gūburinis išvadas — statusas T sritis radioelektronika atitikmenys: angl. solder bump lead; solder bump pad vok. Lötkontakthügel, m rus. столбиковый вывод из припоя, m pranc. poutre de brasure, m …
8poutre de brasure — lydmetalinis gūburinis išvadas statusas T sritis radioelektronika atitikmenys: angl. solder bump lead; solder bump pad vok. Lötkontakthügel, m rus. столбиковый вывод из припоя, m pranc. poutre de brasure, m …
9столбиковый вывод из припоя — lydmetalinis gūburinis išvadas statusas T sritis radioelektronika atitikmenys: angl. solder bump lead; solder bump pad vok. Lötkontakthügel, m rus. столбиковый вывод из припоя, m pranc. poutre de brasure, m …
10System in package — A System in a Package or System in Package (SiP), also known as a Chip Stack MCM, is a number of integrated circuits enclosed in a single package or module. The SiP performs all or most of the functions of an electronic system, and are typically… …
- 1
- 2
