plastic dual in-line package
1plastic dual in-line package — plastikinis dvieilis korpusas statusas T sritis radioelektronika atitikmenys: angl. plastic dual in line package vok. Plastgehäuse mit zweizeilig angeordneten Anschlüssen, n rus. пластмассовый корпус с двухрядным расположением выводов, m pranc.… …
2Plastic Dual In-line Package — Dual Inline Package Pour les articles homonymes, voir DIP. Boîtier DIL à 16 broches …
3Dual in-line package — PDIP redirects here. PDIP may also refer to Indonesian Democratic Party – Struggle. Three 14 pin (DIP14) plastic dual in line packages containing IC chips …
4Shrink Plastic Dual In-line Package — Dual Inline Package Pour les articles homonymes, voir DIP. Boîtier DIL à 16 broches …
5Dual in-line package — ICs in DIP Gehäusen Einfache DIP Fassungen …
6Ceramic Dual In-line Package — Dual Inline Package Pour les articles homonymes, voir DIP. Boîtier DIL à 16 broches …
7dual in-line package — Abbreviated DIP. A standard housing constructed of hard plastic commonly used to hold an integrated circuit. The circuit s leads are connected to two parallel rows of pins designed to fit snugly into a socket; these pins may also be soldered… …
8Zig-zag in-line package — The zig zag in line package or ZIP was a short lived packaging technology for integrated circuits, particularly dynamic RAM chips. It was intended as a replacement for dual in line packaging (DIL or DIP). A ZIP is an integrated circuit… …
9Plastic leaded chip carrier — Microcontrolador Motorola MC68HC711E9CFN3 en encapsulado QFJ52 (PLCC52) …
10Prozessorgehäuse — ICs in DIP Gehäusen Die Ummantelung eines (ungehäusten) Halbleiterchips (ein sog. Die) inklusive der Anschlussstellen (Leads, Pins oder Balls) bezeichnet man als Gehäuse oder Package. Es existieren zahlreiche Variationen solcher Gehäuse, die sich …
