flip-chip bump
1flip-chip bump — gūburinis apverstojo lusto išvadas statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f …
2Flip-Chip-Höcker — gūburinis apverstojo lusto išvadas statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f …
3Flip chip — Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and MEMS, to external circuitry with solder bumps that have been deposited onto the chip pads …
4poutre de flip-chip — gūburinis apverstojo lusto išvadas statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f …
5Chip carrier — A standard sized 8 pin dual in line package (DIP) containing a 555 timer IC. A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or… …
6Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… …
7gūburinis apverstojo lusto išvadas — statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f …
8poutre de cristal inverse — gūburinis apverstojo lusto išvadas statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f …
9столбиковый вывод перевёрнутого кристалла ИС — gūburinis apverstojo lusto išvadas statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f …
10Ultratech, Inc. — Ultratech, Inc. nasdaq|UTEK is a publicly traded international technology company based in San Jose, California which supplies equipment to global semiconductor fabs and foundries, and also makes industry leading tools for nanotechnology… …
