chip level complexity
1Network On Chip — or Network on a Chip (NoC or NOC) is an approach to designing the communication subsystem between IP cores in a System on a Chip (SoC). NoCs can span synchronous and asynchronous clock domains or use unclocked asynchronous logic. NoC applies… …
2System on a chip — The AMD Geode is an x86 compatible system on a chip A system on a chip or system on chip (SoC or SOC) is an integrated circuit (IC) that integrates all components of a computer or other electronic system into a single chip. It may contain digital …
3Instruction level parallelism — (ILP) is a measure of how many of the operations in a computer program can be performed simultaneously. Consider the following program: 1. e = a + b 2. f = c + d 3. g = e * fOperation 3 depends on the results of operations 1 and 2, so it cannot… …
4Central processing unit — CPU redirects here. For other uses, see CPU (disambiguation). An Intel 80486DX2 CPU from above An Intel 80486DX2 from below …
5MOSFET — Two power MOSFETs in the surface mount package D2PAK. Operating as switches, each of these components can sustain a blocking voltage of 120 volts in the OFF state, and can conduct a continuous current of 30 amperes in the ON state, dissipating up …
6Design closure — is the process by which a VLSI design is modified from its initial description to meet a growing list of design constraints and objectives. Every step in the IC design (such as static timing analysis, placement, routing, and so on) is already… …
7Simultaneous multithreading — Simultaneous multithreading, often abbreviated as SMT, is a technique for improving the overall efficiency of superscalar CPUs with hardware multithreading. SMT permits multiple independent threads of execution to better utilize the resources… …
8Unidad central de procesamiento — Oblea de un microprocesador Intel 80486DX2 (tamaño: 12×6,75 mm) en su empaquetado. La unidad central de procesamiento, UCP o CPU (por el acrónimo en inglés de central processing unit), o simplemente el procesador o microprocesador, es el… …
9Thermal management of electronic devices and systems — Heat generated by electronic devices and circuitry must be dissipated to improve reliability and prevent premature failure. Techniques for heat dissipation can include heatsinks and fans for air cooling, and other forms of computer cooling such… …
10Design for manufacturability (IC) — For a general explanation outside the integrated circuit topic, see Design for manufacturability (disambiguation). Achieving high yielding designs in the state of the art, VLSI technology has become an extremely challenging task due to the… …
