chip bump

  • 1flip-chip bump — gūburinis apverstojo lusto išvadas statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f …

    Radioelektronikos terminų žodynas

  • 2Bump mapping — is a computer graphics technique where at each pixel, a perturbation to the surface normal of the object being rendered is looked up in a heightmap and applied before the illumination calculation is done (see, for instance, Phong shading). The… …

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  • 3Chip carrier — A standard sized 8 pin dual in line package (DIP) containing a 555 timer IC. A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or… …

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  • 4Flip-Chip-Höcker — gūburinis apverstojo lusto išvadas statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f …

    Radioelektronikos terminų žodynas

  • 5poutre de flip-chip — gūburinis apverstojo lusto išvadas statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f …

    Radioelektronikos terminų žodynas

  • 6Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… …

    Wikipedia

  • 7Flip chip — Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and MEMS, to external circuitry with solder bumps that have been deposited onto the chip pads …

    Wikipedia

  • 8gūburinis apverstojo lusto išvadas — statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f …

    Radioelektronikos terminų žodynas

  • 9poutre de cristal inverse — gūburinis apverstojo lusto išvadas statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f …

    Radioelektronikos terminų žodynas

  • 10столбиковый вывод перевёрнутого кристалла ИС — gūburinis apverstojo lusto išvadas statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f …

    Radioelektronikos terminų žodynas