board on chip ball grid array
1Ball grid array — For other uses, see BGA (disambiguation). Intel Embedded Pentium MMX (bottom view) A ball grid array (BGA) is a type of surface mount packaging used for integrated circuits. Contents …
2Land grid array — Socket 775 on a motherboard. The land grid array (LGA) is a type of surface mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket rather than the integrated circuit. An LGA can be electrically connected… …
3Pin grid array — A pin grid array, often abbreviated PGA, refers to the arrangement of pins on the integrated circuit packaging. In a PGA, the pins are arranged in a square array that may or may not cover the bottom of the package. The pins are commonly spaced… …
4Chip carrier — A standard sized 8 pin dual in line package (DIP) containing a 555 timer IC. A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or… …
5Printed circuit board — Part of a 1983 Sinclair ZX Spectrum computer board; a populated PCB, showing the conductive traces, vias (the through hole paths to the other surface), and some mounted electrical components A printed circuit board, or PCB, is used to… …
6System on a chip — AMD Geode es un ejemplo de un system on a chip basado en la arquitectura x86 System on a chip o SoC (también referido como system on chip), describe la tendencia cada vez más frecuente de usar tecnologías de fabricación que integran todos o gran… …
7System on a chip — The AMD Geode is an x86 compatible system on a chip A system on a chip or system on chip (SoC or SOC) is an integrated circuit (IC) that integrates all components of a computer or other electronic system into a single chip. It may contain digital …
8Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… …
9Integrated circuit packaging — Early USSR made integrated circuit Integrated circuit packaging is the final stage of semiconductor device fabrication per se, followed by IC testing.Packaging in ceramic or plastic prevents physical damage and corrosion and supports the… …
10AMD 700 chipset series — AMD chipsets Table name = AMD 700 chipset series/ AMD 7 Series Chipsets img w = 100px Codename = Wahoo (790FX, Quad FX) Hammerhead (790FX) Seahorse (780G) CPU = Phenom series Athlon 64 series Sempron series Socket = Socket F+/F (790FX/DSDC)… …
