adhesive interconnect system
1Flip chip — Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and MEMS, to external circuitry with solder bumps that have been deposited onto the chip pads …
2Optical fiber — A bundle of optical fibers A TOSLINK fiber optic audio c …
3Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… …
4cnidarian — /nuy dair ee euhn/, n. 1. any invertebrate animal, as a hydra, jellyfish, sea anemone, or coral, considered as belonging to the phylum Cnidaria, characterized by the specialized stinging structures in the tentacles surrounding the mouth; a… …
5Queensland lungfish — Temporal range: 100–0 Ma …
